News & Articles

SK hynix Inc. has begun mass production of the world's first 12-layer HBM3E product with 36 GB, showcasing its overwhelming technology and leadership in the AI memory market.

Intel's upcoming Core Ultra 200 "Arrow Lake-S" desktop processors are set to revolutionize overclocking memory kits with support for even higher memory speeds, as detailed on the product page of an ASRock Z890 motherboard listing maximum memory speeds for various DIMM configurations, including DDR5-9200+ (OC) for the most overclocker-friendly config of 1 single-rank DIMM per channel.

Micron's HBM3E 12-high 36 GB memory solution offers superior performance, efficiency, and scalability for AI workloads, setting a new standard in the industry.

SK hynix has developed the industry's first 16 Gb DDR5 using its 1c node, marking a significant advancement in memory process technology with improved performance, cost competitiveness, and power efficiency for high-performance data centers.

KLEVV introduces the CRAS V RGB ROG-certified DDR5 Gaming Memory, a collaboration with ROG for mind-bending performance and supreme stability, perfect for hardcore gamers and PC enthusiasts seeking the best in memory technology.

SK hynix Inc. introduces industry-leading GDDR7 graphics memory product with improved speed and power efficiency, set to be adopted in high-end graphics cards and various applications including AI and autonomous driving.

Rambus Inc. introduces DDR5 Client Clock Driver for high-performance desktops and notebooks, bringing server technology advancements to the client market and enabling breakthrough memory performance in next-generation PCs.

Samsung Electronics Co. is set to mass-produce 256 GB DRAM supporting CXL 2.0 by the end of the year, with plans to significantly enhance high-performance server systems through the use of CXL technology, which promises to increase memory capacity per server by eight to ten times.

AMD's upcoming Ryzen 9000 series "Granite Ridge" desktop processors will feature improved memory overclocking capabilities, allowing for DDR5-6400 speeds with a 1:1 ratio between MCLK and FCLK domains.

Competition in the graphics DRAM market is heating up as Samsung, SK Hynix, and Micron race to enhance processing speed and efficiency with the introduction of next-generation GDDR7 memory, set to revolutionize AI accelerators and cryptocurrency mining.