Asetek Unveils Next-Generation Liquid Cooling Platform for AI Computing at Computex 2026
As artificial intelligence continues to drive unprecedented demands for power density and thermal efficiency, Asetek has introduced its latest liquid cooling platform architecture at Computex 2026. Renowned as a global leader in liquid cooling technology, Asetek’s new platform is engineered to meet the rigorous thermal requirements of high-performance AI computing, setting new benchmarks for cooling efficiency and low-noise operation.
Innovative Cold Plate Design Redefines Thermal Standards
Central to Asetek’s next-generation platform is an optimized 4 mm offset cold plate, a comprehensive design that significantly enhances heat dissipation. This innovation establishes a new industry standard for thermal management in AI and high-density computing environments, ensuring processors operate at peak efficiency even under intense workloads.
Strategic Integration with Chunqiu Electronic (CQ)
Asetek’s recent integration with Chunqiu Electronic (CQ) marks a pivotal expansion of its global capabilities. By combining Asetek’s Danish engineering expertise with CQ’s extensive manufacturing scale and supply chain infrastructure in Asia, the company is positioned to deliver advanced liquid cooling solutions on a global scale. This strategic direction supports the evolution of Asetek’s premium consumer platforms and lays the groundwork for future AI and data center thermal infrastructure.
Emma V3 [Gen10]: The Next Evolution in AIO Cooling
Making its debut at Computex, the Emma V3 [Gen10] platform represents a significant leap in all-in-one (AIO) liquid cooling technology. Compared to previous generations, Emma V3 achieves a 1.5°C reduction in thermal resistance and lowers perceived acoustic volume by approximately 45% under typical TDP workloads. The platform features a dual-offset cold plate design, optimized retention kits, and center groove micro-channels—each engineered to address modern CPU hotspot behavior and maximize system integration flexibility for AI workloads.
The Emma V3 platform will be featured in upcoming TRYX ecosystem products and will make its exclusive world debut as the core of an ASUS ROG Limited Special Edition liquid cooler.
Breakthroughs in Gaming AIO Cooling: Ingrid G9 Platform Adoption
Building on the success of the Ingrid platform, which launched with the Antec Vortex View 360, Asetek’s Ingrid G9 technology is now powering flagship AIO models from ADATA, NZXT, and TRYX. The Ingrid platform delivers up to a 3°C reduction in CPU temperatures under typical TDP, addressing both mainstream and value market segments:
- Ingrid Mainstream: Offers ultra-low acoustic performance (18-20 dB(A) at 25 cm) and a simplified pre-installed fan structure, featured in flagship models from NZXT and TRYX.
- Ingrid Value: Developed with ADATA, the Levante View platform brings the same advanced thermal architecture to a more accessible, cost-effective tier, expanding availability to a broader enthusiast audience.
Additional highlights at Computex include the debut of the ASRock Taichi 360 HOLO, powered by Emma V2, and the TRYX HOLO featuring Sigrid V2, which combines advanced thermal engineering with striking visual aesthetics for premium PC enthusiasts.
Professional Workstation Solutions for High-Density Compute
Since 2021, Asetek has focused on developing advanced liquid cooling solutions for professional workstations. Its thermal solutions for Intel Xeon and AMD Ryzen Threadripper processors have gained the trust of industry leaders such as ASUS, Antec, and Phanteks. At Computex 2026, Asetek will showcase Intel Xeon workstation liquid cooling integrations at the ASUS and Phanteks booths, alongside premium AIO coolers for AMD Ryzen Threadripper at the Phanteks and Antec booths.
These workstation AIO solutions feature 100% full Integrated Heat Spreader (IHS) coverage, enabling support for extreme 450 W+ TDP workloads—far surpassing traditional consumer hardware limits. This robust engineering meets the growing demand for reliable, high-performance compute infrastructure in professional environments.
Industry Collaboration and Engineering Leadership
Asetek’s R&D leadership team will be present at Computex 2026 to provide engineering insights and discuss platform advancements with industry media. Asetek’s latest technologies and partner products will be showcased across the booths of ADATA, Antec, ASRock, ASUS ROG, NZXT, Phanteks, and TRYX, highlighting the company’s ongoing commitment to innovation in liquid cooling for AI, gaming, and professional computing.
