Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has unveiled the industry's first comprehensive memory interface chipset solutions for second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).
The new DDR5 MRDIMMs are essential to meet the growing memory bandwidth requirements of Artificial Intelligence (AI), High-Performance Compute (HPC), and other data center applications. They offer operating speeds of up to 12,800 Mega Transfers Per Second (MT/s), representing a 1.35x increase in memory bandwidth compared to first-generation solutions. Renesas has played a key role in the design, development, and deployment of these new MRDIMMs, collaborating with industry leaders in CPU and memory technology, as well as end customers.
Renesas has introduced three critical components for the new MRDIMMs: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). In addition, Renesas offers temperature sensor (TS) and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company to provide complete chipset solutions for next-generation MRDIMMs and other server and client DIMMs.
"The demand for high-performance systems driven by AI and HPC applications continues to grow," said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing at Renesas. "Renesas is leading the way in working with industry partners to develop cutting-edge technology and specifications. These partners rely on Renesas to deliver the technical expertise and production capabilities needed to meet the increasing demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs demonstrate our leadership in this market."
The RRG50120 second-generation MRCD from Renesas buffers the Command/Address (CA) bus, chip selects, and clocks on the MRDIMMs between the host controller and DRAMs. It consumes 45% less power than the first-generation device, which is crucial for managing heat in high-speed systems. The RRG51020 Gen 2 MDB is another key component used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds of up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas' RRG53220 next-generation PMIC offers top-notch electrical-over-stress protection, superior power efficiency, and is optimized for high-current and low-voltage operation.
Availability:
Renesas is currently sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC, with expectations for the new products to be available for production in the first half of 2025.
