AMD Ryzen AI MAX 300-series Processors

AMD Ryzen AI MAX 300-series processors, known as "Strix Halo," have been making headlines for almost a year. These mobile processors combine "Zen 5" CPU cores with a large iGPU that rivals discrete GPUs in performance. The goal is to compete with Apple's M3 Pro and M3 Max processors found in MacBook Pros. The "Strix Halo" mobile processor is a Multi-Chip Module (MCM) that combines one or two "Zen 5" CCDs with a large System on Chip (SoC) die. This die is built on either the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It features a large iGPU based on the RDNA 3.5 graphics architecture with 40 compute units (CU) and a 50 TOPS-class XDNA 2 Neural Processing Unit (NPU) from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked a company slide from a notebook OEM, revealing the iGPU model names for the various Ryzen AI MAX 300-series SKUs. The top-tier processor is the Ryzen AI MAX+ 395, featuring a 16-core/32-thread "Zen 5" CPU with two CCDs. The iGPU is branded Radeon 8060S with all 40 CU enabled. The Ryzen AI MAX 390 comes next with a 12-core/24-thread "Zen 5" CPU and the same Radeon 8060S graphics solution. The popular Ryzen AI MAX 385 has an 8-core/16-thread "Zen 5" CPU and a Radeon 8050S iGPU. Lastly, the entry-level Ryzen AI MAX 380 features a 6-core/12-thread CPU with a 16 CU iGPU.

It is uncertain if all four processor SKUs have the 256-bit LPDDR5X memory interface, with the possibility of the Ryzen AI MAX 380 having a narrower memory interface like 128-bit or 192-bit.