M31 Technology Corporation Achieves Silicon Validation for USB4 IP on TSMC's 5 nm Process

M31 Technology Corporation, a leading global provider of silicon intellectual property (IP), has announced that its cutting-edge USB4 IP has successfully achieved silicon validation on TSMC's 5 nm (N5) process. This newly validated IP enhances data transfer capabilities for a new wave of mobile and portable devices. The announcement coincides with M31's participation in TSMC's 2024 Open Innovation Platform (OIP) Ecosystem Forum in Taiwan, highlighting the close collaboration between M31 and TSMC to drive next-generation connectivity.

M31's USB4 IP is based on the latest USB4 specification and represents a significant advancement in USB architecture. It supports multi-protocol tunneling, allowing simultaneous transmission of various data types over a single connection, including USB, DisplayPort, and PCIe. With 40 Gbps data transfer rates, the USB4 IP significantly boosts bandwidth compared to previous USB standards. It is fully compatible with USB 3.2, USB 2.0, and Thunderbolt 3, ensuring seamless integration with current and future devices. The IP is compliant with PIPE 6.0 and UTMI+ interfaces, supporting multiple data rates such as SuperSpeed (5 Gbps) and SuperSpeed+ (10 Gbps). Operating under 1.2 IO volts, the IP optimizes power efficiency, performance, and area (PPA), making it suitable for high-performance computing (HPC) and portable device applications.

Jerome Hung, M31's Vice President of R&D, emphasized the importance of collaboration with TSMC in overcoming low-voltage design challenges and achieving high-speed data transfer. The joint effort between the two companies ensures that the USB4 IP meets the highest performance and reliability standards for designs using TSMC's advanced 5 nm technology, reducing design risks and accelerating time-to-market. The successful partnership between M31 and TSMC aims to bring more innovative IP solutions to the market.