Eliyan Corporation Achieves Milestone in Chiplet Interconnect Technology
Eliyan Corporation, known for developing the semiconductor industry's most efficient chiplet interconnect, has announced the successful delivery of the first silicon for its NuLink-2.0 PHY. This cutting-edge device is manufactured using a 3 nm process and boasts a remarkable 64 Gbps/bump, making it the highest-performing die-to-die PHY solution for multi-die architectures in the industry. The NuLink-2.0 is fully compatible with the UCIe standard and showcases Eliyan's ability to enhance die-to-die connectivity with double the bandwidth on both standard and advanced packaging, all while maintaining unprecedented power efficiency, area optimization, and low latency.
The NuLink-2.0 is a versatile PHY solution that also supports UMI (Universal Memory Interconnect), a revolutionary chiplet interconnect technology that significantly improves Die-to-Memory bandwidth efficiency. UMI utilizes a dynamic bidirectional PHY, with specifications currently being finalized with the Open Compute Project (OCP) as BoW 2.1. The NuLink-2.0 demo vehicle utilizes standard organic/laminate packaging with 5-2-5 and 8-2-8 stack ups. This highly efficient PHY solution is bump limited and can fit under 90um bump pitch in standard packaging, as well as under 45-55um bump pitches in advanced packaging. It can deliver bandwidth of up to 5Tbps/mm in standard packaging through innovative techniques like reflection and crosstalk cancellation, and up to 21Tbps/mm in advanced packaging with reduced power consumption by leveraging unterminated receivers and simplified cancellation circuitry. The NuLink's low power consumption makes it an ideal solution for custom HBM4 base die, meeting the power density requirements of future AI systems.
The device features a die-to-die PHY paired with an adaptor/link layer controller IP to offer a comprehensive solution tailored for the high-growth AI markets in HPC and edge applications. By utilizing standard packaging to reduce costs, chiplet-based designs can be more widely adopted in inference, gaming, aerospace, automotive, and industrial markets due to easier qualification processes.
"This achievement establishes a new benchmark in performance and total cost of ownership advantages for a variety of multi-die applications," stated Eliyan's CEO Ramin Farjadrad. "The exceptional performance of the NuLink-2.0 opens up new possibilities for architects looking to overcome memory and IO limitations. With its low power consumption and flexibility in packaging technology, allowing for market-specific optimizations, we are proud to offer a solution that will elevate chiplet-based design capabilities across various industries."
