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Corning Unveils Next-Generation EXTREME ULE Glass

Corning Incorporated, a global leader in glass, ceramic, and materials science, has introduced Corning EXTREME ULE Glass, a cutting-edge material designed to assist chip manufacturers in meeting the increasing demand for advanced technologies. This new material will enhance photomasks - crucial for the mass production of today's most advanced microchips.

EXTREME ULE Glass by Corning is specifically engineered to withstand the intense extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV, which is quickly becoming the industry standard. This lithography technique enables manufacturers to utilize advanced photomasks for printing the smallest and most complex chip designs. The material's thermal stability and uniformity are essential for consistent manufacturing performance.

Claude Echahamian, Vice President & General Manager of Corning Advanced Optics, emphasized the importance of glass innovation in meeting the growing demands of integrated chipmaking, particularly with the rise of artificial intelligence. EXTREME ULE Glass will play a key role in advancing EUV manufacturing and improving yield.

The thermal expansion properties of EXTREME ULE Glass ensure consistent performance across all photomasks, while its flatness and uniformity reduce photomask waviness, minimizing variability for manufacturers and enabling the application of advanced coatings.

EXTREME ULE Glass represents a progression in Corning's ULE (Ultra-Low Expansion) glass portfolio, a titania-silicate material known for its near-zero expansion characteristics. Corning's innovative glass-forming process aims to reduce energy consumption and waste generation during production, aligning with the company's sustainability goals.

Corning will showcase EXTREME ULE Glass and other semiconductor materials at the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference in Monterey, California, from September 30 to October 3.